Global Fan-In Wafer Level Packaging Market Size, Status And Forecast 2018 – 2025 | STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies

Press Release

Fan-in Wafer Level Packaging Market size, industry status and forecast, competition landscape and growth opportunity. This research report categorizes the global Fan-in Wafer Level Packaging market by companies, region, type and end-use industry.

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
The analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.
In terms of geographical regions, APAC will be the major revenue contributor to the market throughout the next few years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market?s growth prospects.
In 2017, the global Fan-in Wafer Level Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2018-2025.

This report focuses on the global top players, covered
Texas Instruments
Rudolph Technologies
SUSS MicroTec
FlipChip International

Market segment by Regions/Countries, this report covers
United States
Southeast Asia

Market segment by Type, the product can be split into
200mm Wafer Level Packaging
300mm Wafer Level Packaging

Market segment by Application, split into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC

The study objectives of this report are:
To study and forecast the market size of Fan-in Wafer Level Packaging in global market.
To analyze the global key players, SWOT analysis, value and global market share for top players.
To define, describe and forecast the market by type, end use and region.
To analyze and compare the market status and forecast between China and major regions, namely, United States, Europe, China, Japan, Southeast Asia, India and Rest of World.
To analyze the global key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Fan-in Wafer Level Packaging are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders
Fan-in Wafer Level Packaging Manufacturers
Fan-in Wafer Level Packaging Distributors/Traders/Wholesalers
Fan-in Wafer Level Packaging Subcomponent Manufacturers
Industry Association
Downstream Vendors

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